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semiconductor measurement systemm

  • non contact surface curvature and thin film stress
non contact surface curvature and thin film stress

non contact surface curvature and thin film stress-吉祥棋牌官方正版

  • product description: non contact surface curvature and thin film stress
non contact automated 2d- or 3d measurement of warp, bow, slope and surface curvature with software module for calculation of thin film stress (wafer stress) of wafers and glass substrates.