magnetron sputtering systems
pvd products manufactures complete integrated sputtering systems to meet your specific deposition requirements. these systems can be configured with multiple rf and/or dc magnetron sources ranging in size from 1 inch (25 mm) to 8 inches (200 mm) in diameter. we can provide systems to handle wafers up to 300 mm in diameter, heating up to 900°c, and rf bias with additional ports for diagnostics such as reflection high-energy electron diffraction (rheed), ellipsometry, and multi-beam optical sensors (moss) for in-situ stress measurement.
uhv sputtering and evaporation system for 4-inch wafers with heating to 850°c, rf bias, three uhv magnetrons with in-situ tilt, and three-pocket uhv e-beam source. located at nist, boulder co.
uhv sputtering and evaporation system with hp rheed and in-situ ellipsometry. includes a 4-inch wafer holder with heating to 850°c with rf bias, three 2-inch uhv magnetrons with in-situ tilt, and three-pocket uhv e-beam source.
sputtering chamber for a 4” diameter wafer which can be heated to 850°c with rf bias, loadlock, and six 2” magnetrons with manual in-situ tilt.
sputter-down system for 4-inch diameter substrates with rf bias, load lock, and four 2-inch magnetrons.